Welding, Microwork

The RELIFE 210 Portable Smart Soldering Iron RL-210 is the ideal tool for professional repairers of phones and other electronic devices. With a power of 60W, this soldering iron heats up quickly and allows for efficient solder melting, while providing exceptional precision for meticulous repairs.

Key Features:

60W Power: Fast heating and efficient solder melting.
Adjustable Temperature from 80°C to 420°C: Offering great flexibility to adapt to different repair tasks.
Excellent Temperature Recovery: Stable and reliable performance throughout soldering sessions.
Customizable Settings: Standby temperature, standby time, working voltage, and support for multiple languages ​​and temperature units to suit your preferences.
Compact and Portable Design: Easy to carry, ideal for travel or small workspaces.
Wide Compatibility: Compatible with most 210 heating cores available on the market.


The RELIFE RL-210 is the perfect solution for professionals looking for a practical, high-performance, and versatile soldering iron. Thanks to its advanced settings and portable design, it will allow you to achieve optimal precision in your repair work.

The RELIFE TF1 Mini is a high-temperature tempered glass insulating pad specially designed for smartphone motherboard repairs. Compact, practical, and durable, it is an essential tool for technicians specializing in micro-soldering and integrated circuit repair.

Key Features:

Mini and Portable Size: Suitable for small mobile phone motherboards, ideal for chip removal and installation operations (CPU, memory, hard drive, etc.).
Wide Compatibility: Suitable for a wide range of electronic components: ICs, chips, CPUs, hard drives, etc., for versatile and efficient repairs.
Premium Material: Made of high-quality silicone, offering resistance to wear, high temperatures (up to 500°C), corrosion, and burns, while protecting hands during work.
Internal Bevel Design: Ensures precise and stable component clamping, suspends the motherboard in the air to reduce heat dissipation by conduction, allowing for rapid desoldering without damaging the circuits.
High-strength tempered glass panel: Will not warp under prolonged heat, even above 500°C, ensuring optimal durability under intensive use.


The RELIFE TF1 Mini is the ideal solution for demanding professionals seeking a reliable, secure, and durable support for all precision electronic repair operations.

Pistolet à Air Chaud 3A BST-8016